A unique formula created permit high viscosity friction and reduce temperature.
When temperature rises during polishing, it will affect the productivity rate as the compound becomes sticky and it will start to clog up.
Celebrate is able to reduce temperature and allow the polishing action to continue without compromising the cutting ability of the compound.
Recommended application :
1) Spray after compound is applied onto pad.
2) Spray before compound is applied onto pad.
3) Spray directly at surface intended to polish.
Celebrate is not purely a heat reducing product. It can remove compound residue off almost any surface. Spray celebrate onto the surface and agitate with brush. Wipe off compound residue with proper towel.
Do not dilute celebrate with water as it will become ineffective.